Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
- Patent Title (中): 具有电路的悬挂板及其制造方法
-
Application No.: US12457576Application Date: 2009-06-16
-
Publication No.: US07957614B2Publication Date: 2011-06-07
- Inventor: Jun Ishii , Hitoki Kanagawa , Toshiki Naito
- Applicant: Jun Ishii , Hitoki Kanagawa , Toshiki Naito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2008-172617 20080701
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/26
Abstract:
A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
Public/Granted literature
- US20100002985A1 Suspension board with circuit and producing method thereof Public/Granted day:2010-01-07
Information query
