Invention Grant
- Patent Title: Component mounter control method and component mounter
- Patent Title (中): 组件安装器控制方法和组件安装机
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Application No.: US12162686Application Date: 2007-01-30
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Publication No.: US07957822B2Publication Date: 2011-06-07
- Inventor: Keita Morita
- Applicant: Keita Morita
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-034447 20060210
- International Application: PCT/JP2007/051863 WO 20070130
- International Announcement: WO2007/091499 WO 20070816
- Main IPC: G05B13/02
- IPC: G05B13/02 ; G06F19/00 ; B23P19/00

Abstract:
A method controls a component mounter which includes a mobile unit for mounting a component onto a circuit board, and judges on which side of the component mounter as user, who issues an instruction to the component mounter, is present. Additionally, the method performs position control by shifting the mobile unit to a position which allows a maintenance task to be performed on the component mounter from the side on which the user is judged to be present.
Public/Granted literature
- US20090049680A1 COMPONENT MOUNTER CONTROL METHOD AND COMPONENT MOUNTER Public/Granted day:2009-02-26
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