Invention Grant
US07957829B2 Method for positioning and/or guiding at least one arbitrary process head for the metalization of thin substrates at a defined distance above the substrate surface 失效
用于定位和/或引导至少一个任意处理头的方法,用于在衬底表面上方的限定距离处对薄衬底进行金属化

Method for positioning and/or guiding at least one arbitrary process head for the metalization of thin substrates at a defined distance above the substrate surface
Abstract:
A method for positioning or guiding at least one arbitrary print head or a printing unit having at least one pressure nozzle for the imprinting of thin substrates such as wafers at a defined distance above the surface of the substrate, which is to be provided on a support like a paddle or printing table. Distance sensors continuously acquired distance measurements to the surface of the substrate which is to be imprinted. An adjustment of the print head up to 6 degrees of freedom is ensured by actuators in such a manner that the section of the opening of the pressure nozzle of the print head can be adjusted so as to be coplanar to the section of the surface of the substrate which is to be imprinted. The print head is thus maintained or readjusted so as to adjust the section of the opening of the pressure nozzle of the print head to the surface of the substrate which is to be positioned on the support table so as to be coplanar and so as to maintain the coplanar position during the printing process.
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