Invention Grant
- Patent Title: Low-pressure process apparatus
- Patent Title (中): 低压加工设备
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Application No.: US11421501Application Date: 2006-06-01
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Publication No.: US07958612B2Publication Date: 2011-06-14
- Inventor: Ting-Hui Huang
- Applicant: Ting-Hui Huang
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corp.
- Current Assignee: Au Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas|Kayden
- Priority: TW94146971A 20051228
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A low-pressure process apparatus for processing a substrate comprises a base, a stage, a housing and at least one first roller set. The stage is disposed on the base for supporting the substrate. The housing is detachably disposed on the base moving between a first position and a second position, wherein when the housing is in a first position, the housing and the base form a chamber to receive the stage. When the housing is detached, the first roller set contacts and supports the housing to facilitate movement thereof in a first horizontal direction.
Public/Granted literature
- US20070144029A1 LOW-PRESSURE PROCESS APPARATUS Public/Granted day:2007-06-28
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