Invention Grant
US07958627B2 Method of attaching an electronic device to an MLCC having a curved surface
有权
将电子设备附接到具有弯曲表面的MLCC的方法
- Patent Title: Method of attaching an electronic device to an MLCC having a curved surface
- Patent Title (中): 将电子设备附接到具有弯曲表面的MLCC的方法
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Application No.: US12236126Application Date: 2008-09-23
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Publication No.: US07958627B2Publication Date: 2011-06-14
- Inventor: Michael S. Randall , Chris Wayne , John McConnell
- Applicant: Michael S. Randall , Chris Wayne , John McConnell
- Applicant Address: US SC Greenville
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Current Assignee Address: US SC Greenville
- Agency: Nexsen Pruet, LLC
- Agent Joseph T. Guy
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.
Public/Granted literature
- US20090077800A1 METHOD OF ATTACHING AN ELECTRONIC DEVICE TO AN MLCC HAVING A CURVED SURFACE Public/Granted day:2009-03-26
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