Invention Grant
- Patent Title: Pressing machine with die cushion device
- Patent Title (中): 压模机带模具缓冲装置
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Application No.: US11794935Application Date: 2006-01-12
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Publication No.: US07958765B2Publication Date: 2011-06-14
- Inventor: Kiyokazu Baba , Hiroaki Honma , Masahide Sunata , Hajime Yoshida , Hirohide Satou
- Applicant: Kiyokazu Baba , Hiroaki Honma , Masahide Sunata , Hajime Yoshida , Hirohide Satou
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Komatsu Ltd.,Komatsu Industries Corp.
- Current Assignee: Komatsu Ltd.,Komatsu Industries Corp.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2005-006794 20050113
- International Application: PCT/JP2006/300289 WO 20060112
- International Announcement: WO2006/075659 WO 20060720
- Main IPC: B21D22/00
- IPC: B21D22/00 ; B21J9/18 ; B30B1/32

Abstract:
A pressing machine 1 includes: a bed 6 on which a die-cushion device 10 is provided; and a bolster 51 provided on the bed 6. The bed 6 has an inner space 61 in which a die-cushion pad 13 of the die-cushion device 10 is lifted up and down. A supporting portion 63 penetrating the die-cushion pad 13 in a lifting direction and supporting a lower surface of the bolster 51 via a carrier 52 is provided in the inner space 61. With this arrangement, since the bolster 51 is supported by the supporting portion 63, the bolster 51 can be prevented from being flexed during a press forming operation, whereby a highly accurate press forming operation can be realized. In addition, since the supporting portion 63 penetrates the die-cushion pad 13, unlike conventional arrangements, the die-cushion pad 13 does not need to be divided, whereby a complication of the arrangement can be avoided.
Public/Granted literature
- US20080141751A1 Pressing Machine with Die Cushion Device Public/Granted day:2008-06-19
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