Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US10571898Application Date: 2005-02-16
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Publication No.: US07958842B2Publication Date: 2011-06-14
- Inventor: Shizue Ogawa , Kazuyuki Toyoda , Motonari Takebayashi , Tadashi Kontani , Nobuo Ishimaru
- Applicant: Shizue Ogawa , Kazuyuki Toyoda , Motonari Takebayashi , Tadashi Kontani , Nobuo Ishimaru
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2004-055446 20040227
- International Application: PCT/JP2005/002306 WO 20050216
- International Announcement: WO2005/083766 WO 20050909
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A substrate processing apparatus comprising: a processing chamber which is to accommodate at least one substrate; a gas supply system which is to supply processing gas into the processing chamber; an exhaust system which is to exhaust atmosphere in the processing chamber; and at least one pair of electrodes which are to bring the processing gas into an active state and which are accommodated in protection tubes such that the electrodes can be inserted into and pulled out from the protection tubes, wherein the electrodes are accommodated in the protection tube in a state where at least a portion of the electrodes is bent, and the electrodes are formed of flexible members, is disclosed.
Public/Granted literature
- US20080153308A1 Substrate Processing Apparatus Public/Granted day:2008-06-26
Information query
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