Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US11864081Application Date: 2007-09-28
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Publication No.: US07958898B2Publication Date: 2011-06-14
- Inventor: Takeshi Yoshida
- Applicant: Takeshi Yoshida
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2006-272147 20061003
- Main IPC: B08B3/08
- IPC: B08B3/08

Abstract:
An substrate processing apparatus includes a substrate holding unit, a process liquid supplying unit, a first guide portion provided around the substrate holding unit for guiding the process liquid scattered from the substrate, a second guide portion provided outside the first guide portion for guiding the process liquid scattered from the substrate, a third guide portion provided outside the second guide portion for guiding the process liquid scattered from the substrate, a first recovery channel provided outside the first guide portion integrally with the first guide portion for recovering the process liquid guided by the second guide portion, a second recovery channel provided outside the first recovery channel integrally with the first guide portion for recovering the process liquid guided by the third guide portion, and a driving mechanism for independently moving up and down the first, second, and third guide portions.
Public/Granted literature
- US20080078428A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2008-04-03
Information query
IPC分类: