Invention Grant
- Patent Title: Thermally induced single-use valves and method of use
- Patent Title (中): 热诱导一次性阀门及使用方法
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Application No.: US11734090Application Date: 2007-04-11
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Publication No.: US07958906B2Publication Date: 2011-06-14
- Inventor: Andres M. Cardenas-Valencia , Jay Dlutowski , Michelle Cardenas , John Bumgarner , Weidong Wang , Larry Langebrake
- Applicant: Andres M. Cardenas-Valencia , Jay Dlutowski , Michelle Cardenas , John Bumgarner , Weidong Wang , Larry Langebrake
- Applicant Address: US FL Tampa
- Assignee: University of South Florida
- Current Assignee: University of South Florida
- Current Assignee Address: US FL Tampa
- Agency: Smith & Hopen, P.A.
- Agent Molly L. Sauter
- Main IPC: F16K17/36
- IPC: F16K17/36
Abstract:
In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
Public/Granted literature
- US20100180953A1 Thermally Induced Single-Use Valves and Method of Use Public/Granted day:2010-07-22
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