Invention Grant
- Patent Title: Wave soldering tank
- Patent Title (中): 波峰焊锡罐
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Application No.: US12225925Application Date: 2007-04-02
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Publication No.: US07959055B2Publication Date: 2011-06-14
- Inventor: Mitsuo Zen , Hirokazu Ichikawa , Satoshi Ozawa
- Applicant: Mitsuo Zen , Hirokazu Ichikawa , Satoshi Ozawa
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Michael Tobias
- Priority: JP2006-103736 20060405
- International Application: PCT/JP2007/057375 WO 20070402
- International Announcement: WO2007/116853 WO 20071018
- Main IPC: B23K1/08
- IPC: B23K1/08 ; B23K31/02

Abstract:
In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric.A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.
Public/Granted literature
- US20100001047A1 WAVE SOLDERING TANK Public/Granted day:2010-01-07
Information query
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