Invention Grant
- Patent Title: Electronic inlay module used for electronic cards and tags
- Patent Title (中): 用于电子卡片和标签的电子嵌体模块
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Application No.: US11697827Application Date: 2007-04-09
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Publication No.: US07959085B2Publication Date: 2011-06-14
- Inventor: Robert W. Singleton
- Applicant: Robert W. Singleton
- Applicant Address: US FL Lakeland
- Assignee: Innovatier, Inc.
- Current Assignee: Innovatier, Inc.
- Current Assignee Address: US FL Lakeland
- Agency: Foley & Lardner LLP
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.
Public/Granted literature
- US20070235548A1 ELECTRONIC INLAY MODULE USED FOR ELECTRONIC CARDS AND TAGS Public/Granted day:2007-10-11
Information query
