Invention Grant
US07959126B2 Moldboard positioning assembly and use thereof 失效
模板定位组件及其用途

  • Patent Title: Moldboard positioning assembly and use thereof
  • Patent Title (中): 模板定位组件及其用途
  • Application No.: US11865801
    Application Date: 2007-10-02
  • Publication No.: US07959126B2
    Publication Date: 2011-06-14
  • Inventor: Jen-Hsin Lee
  • Applicant: Jen-Hsin Lee
  • Agency: Abelman, Frayne & Schwab
  • Priority: TW95141498A 20061109
  • Main IPC: E04G11/00
  • IPC: E04G11/00
Moldboard positioning assembly and use thereof
Abstract:
A moldboard positioning assembly is adapted for positioning at least two spaced-apart moldboards each having at least one through hole. The moldboard positioning assembly includes a spacer block and two threaded connecting poles. The spacer block is adapted for passing through the through hole of one of the moldboards and is adapted to be disposed between and to abut against the moldboards. The threaded connecting poles respectively project from two opposite ends of the spacer block, and each of the threaded connecting poles is adapted to penetrate through the through hole of a corresponding one of the moldboards. The spacer block has a cross section larger than that of the threaded connecting poles.
Public/Granted literature
Information query
Patent Agency Ranking
0/0