Invention Grant
- Patent Title: Data interfacing apparatus of print head chip
- Patent Title (中): 打印头芯片的数据接口装置
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Application No.: US11767690Application Date: 2007-06-25
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Publication No.: US07959244B2Publication Date: 2011-06-14
- Inventor: Seong-nam Jeon
- Applicant: Seong-nam Jeon
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2007-0006295 20070119
- Main IPC: B41J29/38
- IPC: B41J29/38 ; H03K17/16

Abstract:
A data interfacing apparatus and method of a print head chip are provided. The data interfacing apparatus includes a drive module to output a low-speed signal with a slow transmission speed and a high-speed signal requiring a fast transmission speed, a connection cable transmitting the low-speed signal and the high-speed signal, and a print head chip to operate in response to the low-speed signal and the high-speed signal transmitted through the connection cable, wherein the drive module includes multiplexers to perform a switching operation so that the connection cable is earthed to a ground in response to the high-speed signal, and wherein the print head chip includes de-multiplexers to perform a switching operation in response to the operation of the multiplexers.
Public/Granted literature
- US20080174616A1 DATA INTERFACING APPARATUS AND METHOD OF PRINT HEAD CHIP Public/Granted day:2008-07-24
Information query
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