Linear semiconductor processing facilities

Invention Grant

US07959403B2 Linear semiconductor processing facilities 有权

Title translation: 线性半导体加工设备

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Patent Title: Linear semiconductor processing facilities
Patent Title (中): 线性半导体加工设备
Application No.: US11846290

Application Date: 2007-08-28
Publication No.: US07959403B2

Publication Date: 2011-06-14
Inventor: Peter van der Meulen
Applicant: Peter van der Meulen
Agency: Perman & Green, LLP
Agent Richard Pickreign
Main IPC: H01L21/677
IPC: H01L21/677

Linear semiconductor processing facilities

Abstract:

Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.

Abstract(Chinese):

提供了用于处理材料的方法和系统，包括在半导体制造系统中使用的材料。该方法和系统包括用于基于真空的半导体处理和处理的线性半导体处理设备，以及可以灵活地配置以满足各种限制的可连接或可扩展的半导体处理设备。

Public/Granted literature

US20080085173A1 LINEAR SEMICONDUCTOR PROCESSING FACILITIES Public/Granted day:2008-04-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/67	.专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置
H01L21/677	..用于传送的，例如在不同的工作站之间