Invention Grant
- Patent Title: Wet mate connector
- Patent Title (中): 湿配接头
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Application No.: US12839077Application Date: 2010-07-19
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Publication No.: US07959454B2Publication Date: 2011-06-14
- Inventor: Srikanth Ramasubramanian , Roy Jazowski , Gregory Sivik
- Applicant: Srikanth Ramasubramanian , Roy Jazowski , Gregory Sivik
- Applicant Address: US FL Daytona Beach
- Assignee: Teledyne ODI, Inc.
- Current Assignee: Teledyne ODI, Inc.
- Current Assignee Address: US FL Daytona Beach
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H01R4/60
- IPC: H01R4/60

Abstract:
A submersible connector has releasably mateable plug and receptacle units. The plug unit has at least one electrical pin while the receptacle unit has at least one electrical socket module which receives a forward portion of the electrical pin when the units are mated. The pin is surrounded by semi-conductive seals and a conductive housing, while the socket module has a semi-conductive outer layer, and front seals of semi-conductive material on the pin and socket modules are in sealing engagement in the mated condition, isolating the pins from sea water exposure and forming a ground plane continuation at least from receptacle to plug in the mated condition and providing shielding from phase to phase interaction in a multiple pin and socket connector.
Public/Granted literature
- US20110021049A1 WET MATE CONNECTOR Public/Granted day:2011-01-27
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