Invention Grant
- Patent Title: Communication module ground contact
- Patent Title (中): 通讯模块接地
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Application No.: US12611843Application Date: 2009-11-03
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Publication No.: US07959467B2Publication Date: 2011-06-14
- Inventor: Gary D. Sasser , Chris Togami
- Applicant: Gary D. Sasser , Chris Togami
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Gilmore & Israelsen
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A transceiver module that utilizes a side contact spring portion to ground a shielded cable that is plugged into the transceiver module. In one example embodiment, a transceiver module includes a housing, a jack, and a side contact spring portion. The housing is operative to be electrically connected to chassis ground when the transceiver module is received within a host port. The jack is defined in the housing and operative to receive a shielded plug. The side contact spring portion is substantially implemented within the jack and is configured to be in electrical contact with both the housing and a conductive element of the shielded plug received by the jack such that a chassis ground is established between the housing and the shielded plug and such that a moveable bail pivot lever is able to move without disrupting the electrical contact between the side contact spring portion and the housing and/or the conductive element of the shielded plug.
Public/Granted literature
- US20100112861A1 COMMUNICATION MODULE GROUND CONTACT Public/Granted day:2010-05-06
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