An electrophoretic dip coating plant comprises at least one dip tank, which is filled with a coating fluid. The objects which are to be coated are carried by means of a conveyor system through the coating fluid located in the dip tank and are then in electrical contact with a bus bar arrangement comprising an input and/or output region and a main region. The main region of the bus bar arrangement is connected to one terminal of a d.c. voltage supply unit. The other terminal of this d.c. voltage supply unit is electrically connected to at least one electrode which is immersed in the coating fluid in the dip tank. In order to enable the voltages which are applied to the adjacent regions of the bus bar arrangement to be regulated independently of one another, yet still to manage with a single d.c. voltage supply unit, the adjacent regions are connected together via a controllable semiconductor switch which is capable of transferring the voltage which is applied to the main region at a controllable magnitude to the input and/or output region of the bus bar arrangement.