Invention Grant
- Patent Title: Coupling structure, coupling process and coupling apparatus of laminate film
- Patent Title (中): 层压膜的耦合结构,耦合过程和耦合装置
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Application No.: US11490018Application Date: 2006-07-21
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Publication No.: US07960002B2Publication Date: 2011-06-14
- Inventor: Katsunori Futase
- Applicant: Katsunori Futase
- Applicant Address: JP Saitama
- Assignee: Taisei Lamick Co., Ltd.
- Current Assignee: Taisei Lamick Co., Ltd.
- Current Assignee Address: JP Saitama
- Agency: Greenblum & Bernstein P.L.C.
- Main IPC: B32B3/00
- IPC: B32B3/00

Abstract:
A coupled portion of mutual laminate films sufficiently contributes to the formation of a packaging bag in that the coupled portion itself has excellent air tightness and liquid tightness. The tensile strength required for the laminate film is given to the coupled portion, whereby a temporary stop of a packaging apparatus is useless when a connecting portion of the laminate film is passed through the apparatus, thereby enhancing the operation efficiency and improving the yield of the material. Oriented base film layers are joined in a mitre form at the coupled portion between a rear end portion and a front end portion of laminate films comprising oriented base film layers and sealant layers.
Public/Granted literature
- US20060254697A1 Coupling structure, coupling process and coupling apparatus of laminate film Public/Granted day:2006-11-16
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