Invention Grant
- Patent Title: Method of forming ferromagnetic material, transistor and method of manufacturing the same
- Patent Title (中): 形成铁磁材料的方法,晶体管及其制造方法
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Application No.: US12450355Application Date: 2008-03-26
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Publication No.: US07960186B2Publication Date: 2011-06-14
- Inventor: Satoshi Sugahara , Yota Takamura
- Applicant: Satoshi Sugahara , Yota Takamura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Institute of Technology
- Current Assignee: Tokyo Institute of Technology
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-078925 20070326
- International Application: PCT/JP2008/055769 WO 20080326
- International Announcement: WO2008/123321 WO 20081016
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The disclosure provides a method of forming a ferromagnetic material, including: forming a magnetic element layer on a semiconductor layer formed on an inhibition layer; and forming a ferromagnetic layer of a Heusler alloy layer on the inhibition layer by heat treatment to induce the semiconductor layer and the magnetic element layer to react with each other, and a transistor, and a method of manufacturing the same. The inhibition layer for inhibiting a reaction of the semiconductor layer and the magnetic element layer restricts a semiconductor to be supplied for a reaction of the semiconductor and the magnetic element. Therefore, it is possible to form a ferromagnetic material having a high composition ratio of a magnetic element.
Public/Granted literature
- US20100171158A1 METHOD OF FORMING FERROMAGNETIC MATERIAL, TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-07-08
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