Invention Grant
- Patent Title: Polishing method
- Patent Title (中): 抛光方法
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Application No.: US12465024Application Date: 2009-05-13
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Publication No.: US07960188B2Publication Date: 2011-06-14
- Inventor: Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
- Applicant: Shinrou Ohta , Mitsuo Tada , Noburu Shimizu , Yoichi Kobayashi , Taro Takahashi , Eisaku Hayashi , Hiromitsu Watanabe , Tatsuya Kohama , Itsuki Kobata
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoff, Lind & Ponack, L.L.P.
- Priority: JP2008-127811 20080515; JP2009-029993 20090212
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/302 ; G01R31/26
Abstract:
A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.
Public/Granted literature
- US20090286332A1 POLISHING METHOD Public/Granted day:2009-11-19
Information query
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