Invention Grant
US07960215B2 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
有权
电子装置，安装有电子装置的电子装置，配备有电子装置的物品和电子装置的制造方法
- Patent Title: Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
- Patent Title (中): 电子装置，安装有电子装置的电子装置，配备有电子装置的物品和电子装置的制造方法
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Application No.: US12559219Application Date: 2009-09-14
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Publication No.: US07960215B2Publication Date: 2011-06-14
- Inventor: Hiroshi Kobayashi , Kenji Kobae , Shuichi Takeuchi , Hidehiko Kira
- Applicant: Hiroshi Kobayashi , Kenji Kobae , Shuichi Takeuchi , Hidehiko Kira
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/24 ; H01L23/28 ; H01L23/04
Abstract:
An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.
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