Invention Grant
- Patent Title: Manufacturing method for double-side capacitor of stack DRAM
- Patent Title (中): 堆叠DRAM双面电容器制造方法
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Application No.: US12698322Application Date: 2010-02-02
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Publication No.: US07960241B2Publication Date: 2011-06-14
- Inventor: Shin-Bin Huang , Tzung-Han Lee , Chung-Lin Huang
- Applicant: Shin-Bin Huang , Tzung-Han Lee , Chung-Lin Huang
- Applicant Address: TW Taoyuan County
- Assignee: Inotera Memories, Inc.
- Current Assignee: Inotera Memories, Inc.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW98130663A 20090911
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A manufacturing method for double-side capacitor of stack DRAM has steps of: forming a sacrificial structure in the isolating trench and the capacitor trenches; forming a first covering layer and a second covering layer on the sacrificial structure; modifying a part of the second covering layer; removing the un-modified second covering layer and the first covering layer to expose the sacrificial structure; removing the exposed part of the sacrificial structure to expose the electrode layer; removing the exposed electrode layer to expose the oxide layer; and removing the oxide layer and sacrificial structure to form the double-side capacitors.
Public/Granted literature
- US20110065253A1 MANUFACTURING METHOD FOR DOUBLE-SIDE CAPACITOR OF STACK DRAM Public/Granted day:2011-03-17
Information query
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