Invention Grant
US07960287B2 Methods for fabricating FinFET structures having different channel lengths
有权
制造具有不同沟道长度的FinFET结构的方法
- Patent Title: Methods for fabricating FinFET structures having different channel lengths
- Patent Title (中): 制造具有不同沟道长度的FinFET结构的方法
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Application No.: US12891365Application Date: 2010-09-27
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Publication No.: US07960287B2Publication Date: 2011-06-14
- Inventor: Frank Scott Johnson , Richard T. Schultz
- Applicant: Frank Scott Johnson , Richard T. Schultz
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries Inc.
- Current Assignee: GlobalFoundries Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/311
- IPC: H01L21/311

Abstract:
Methods for fabricating FinFET structures having gate structures of different gate widths are provided. The methods include the formation of sidewall spacers of different thicknesses to define gate structures of the FinFET structures with different gate widths. The width of a sidewall spacer is defined by the height of the structure about which the sidewall spacer is formed, the thickness of the sidewall spacer material layer from which the spacer is formed, and the etch parameters used to etch the sidewall spacer material layer. By forming structures of varying height, forming the sidewall spacer material layer of varying thickness, or a combination of these, sidewall spacers of varying width can be fabricated and subsequently used as an etch mask so that gate structures of varying widths can be formed simultaneously.
Public/Granted literature
- US20110014791A1 METHODS FOR FABRICATING FINFET STRUCTURES HAVING DIFFERENT CHANNEL LENGTHS Public/Granted day:2011-01-20
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