Invention Grant
- Patent Title: Wiring device and cover plate snap-on assembly
- Patent Title (中): 接线装置和盖板卡扣组件
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Application No.: US11744637Application Date: 2007-05-04
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Publication No.: US07960651B2Publication Date: 2011-06-14
- Inventor: David Alderson , Michael D. Williams , Clifford G. Martin
- Applicant: David Alderson , Michael D. Williams , Clifford G. Martin
- Applicant Address: US NY Melville
- Assignee: Leviton Manufacturing Company, Inc.
- Current Assignee: Leviton Manufacturing Company, Inc.
- Current Assignee Address: US NY Melville
- Agency: Collard & Roe, P.C.
- Main IPC: H02G3/14
- IPC: H02G3/14 ; H05K5/03
Abstract:
The present invention relates to an installation of a wiring device configured to receive a cover plate which snaps on to a wiring device such as a switch or receptacle. With this invention, openings for threaded fasteners in the face of the cover plate are eliminated. In an embodiment, the cover plate has an opening sized to accommodate a wiring device and supports, on opposing side walls of the opening, at least one protrusion. The protrusions on the cover plate are located to detachably engage corresponding protrusions on the wiring device as the cover plate is pressed onto the wiring device.
Public/Granted literature
- US20080017398A1 WIRING DEVICE AND COVER PLATE SNAP-ON ASSEMBLY Public/Granted day:2008-01-24
Information query
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