Invention Grant
- Patent Title: Conductive nanowires for electrical interconnect
- Patent Title (中): 导电纳米线用于电气互连
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Application No.: US12259997Application Date: 2008-10-28
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Publication No.: US07960653B2Publication Date: 2011-06-14
- Inventor: Shih-Yuan Wang , Sagi Mathai , Wei Wu
- Applicant: Shih-Yuan Wang , Sagi Mathai , Wei Wu
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01R4/00
- IPC: H01R4/00

Abstract:
An electrical interconnect includes first and second electrical contacts to be electrically connected, each electrical contact having a plurality of electrically conductive nanowires extending outwardly from a respective electrical contact; and the nanowires of the first electrical contact configured to mesh with the nanowires of the second electrical contact such that an electrical connection is established between the first electrical contact and the second electrical contact. A method for interconnecting electrical contacts includes meshing a first array of electrically conductive nanowires extending from a first electrical contact with a second array of electrically conductive nanowires extending from a second electrical contact so as to establish an electrical connection between said first and second electrical contacts.
Public/Granted literature
- US20100018747A1 Conductive Nanowires For Electrical Interconnect Public/Granted day:2010-01-28
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