Invention Grant
- Patent Title: Carbon bonded carbon foam EMI shielding enclosures
- Patent Title (中): 碳粘结碳泡沫EMI屏蔽外壳
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Application No.: US11421845Application Date: 2006-06-02
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Publication No.: US07960656B2Publication Date: 2011-06-14
- Inventor: Thomas M. Matviya
- Applicant: Thomas M. Matviya
- Applicant Address: US WV Triadelphia
- Assignee: Touchstone Research Laboratory, Ltd.
- Current Assignee: Touchstone Research Laboratory, Ltd.
- Current Assignee Address: US WV Triadelphia
- Agent Philip D. Lane
- Main IPC: H01R4/00
- IPC: H01R4/00

Abstract:
Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference and various methods for producing such enclosures are described. Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference may be prepared by bonding at least two sections of carbon foam with a carbonizable binder to provide an enclosure, wherein said enclosure defines an at least partially enclosed volume, and carbonizing the carbonizable binder to provide an electrically conductive carbon char. An enclosure for at least partially shielding an at least partially enclosed volume from electromagnetic interference may include at least two sections of electrically conductive carbon foam interconnected by an electrically conductive carbon char. The electrically conductive carbon char is substantially electrically continuous with the sections of electrically conductive carbon foam.
Public/Granted literature
- US20070278003A1 CARBON BONDED CARBON FOAM EMI SHIELDING ENCLOSURES Public/Granted day:2007-12-06
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