Invention Grant
- Patent Title: Hybrid thermal cutting apparatus
- Patent Title (中): 混合热切割装置
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Application No.: US11630141Application Date: 2005-06-20
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Publication No.: US07960669B2Publication Date: 2011-06-14
- Inventor: Yoshihiro Yamaguchi , Tetsuya Kabata , Ikuo Kamada
- Applicant: Yoshihiro Yamaguchi , Tetsuya Kabata , Ikuo Kamada
- Applicant Address: JP Komatsu-shi
- Assignee: Komatsu Industries Corporation
- Current Assignee: Komatsu Industries Corporation
- Current Assignee Address: JP Komatsu-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2004-187367 20040625
- International Application: PCT/JP2005/011239 WO 20050620
- International Announcement: WO2006/001242 WO 20060105
- Main IPC: B23K10/00
- IPC: B23K10/00 ; B23K26/00

Abstract:
A hybrid thermal cutting apparatus has both a laser head and a plasma torch, both of which can be controlled independently, can perform both laser processing and plasma processing, thus reducing the running costs. A large number of cutting lines for cutting out various types of manufactured products from plate materials are classified into a laser cutting type and a plasma cutting type, according to the cutting length, whether they are the external periphery of manufactured products or apertures, the size of the manufactured products or the apertures, the required process accuracy, the plate thickness, or the like. The lines of the laser cutting type are cut by laser processing, while the lines of the plasma cutting type are cut by plasma processing.
Public/Granted literature
- US20070241083A1 Multiple Thermal Cutting Device and Multiple Thermal Cutting Method Public/Granted day:2007-10-18
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