Invention Grant
- Patent Title: Methods of and apparatuses for measuring electrical parameters of a plasma process
- Patent Title (中): 测量等离子体工艺电参数的方法和装置
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Application No.: US11281238Application Date: 2005-11-16
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Publication No.: US07960670B2Publication Date: 2011-06-14
- Inventor: Randall S. Mundt , Paul D. MacDonald , Andrew Beers , Mason L. Freed , Costas J. Spanos
- Applicant: Randall S. Mundt , Paul D. MacDonald , Andrew Beers , Mason L. Freed , Costas J. Spanos
- Applicant Address: US CA San Jose
- Assignee: KLA-TENCOR Corporation
- Current Assignee: KLA-TENCOR Corporation
- Current Assignee Address: US CA San Jose
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: B23K10/00
- IPC: B23K10/00

Abstract:
A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and at least one transducer coupled to the at least one sensing element. The transducer is configured so as to receive a signal from the sensing element and converting the signal into a second signal for input to the information processor.
Public/Granted literature
- US20060249729A1 Methods of and apparatuses for measuring electrical parameters of a plasma process Public/Granted day:2006-11-09
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