Invention Grant
- Patent Title: Structure of light emitting diode and method to assemble thereof
- Patent Title (中): 发光二极管的结构及其组装方法
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Application No.: US12012379Application Date: 2008-02-01
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Publication No.: US07960740B2Publication Date: 2011-06-14
- Inventor: Sheng-Jia Sheu , Chien-Chang Pei
- Applicant: Sheng-Jia Sheu , Chien-Chang Pei
- Applicant Address: TW Tu Chen, Taipei Hsien
- Assignee: Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Electronics Co., Ltd.
- Current Assignee Address: TW Tu Chen, Taipei Hsien
- Agency: Moser IP Law Group
- Priority: TW96106508A 20070226
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
Public/Granted literature
- US20080203422A1 Structure of light emitting diode and method to assemble thereof Public/Granted day:2008-08-28
Information query
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