Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US12020709Application Date: 2008-01-28
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Publication No.: US07960747B2Publication Date: 2011-06-14
- Inventor: Hironobu Sakamoto , Dai Aoki , Takahiro Saida
- Applicant: Hironobu Sakamoto , Dai Aoki , Takahiro Saida
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2007-019595 20070130
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device is configured to prevent leakage of light but can be reduced in thickness as compared with conventional devices, and can effectively prevent degradation in luminous flux (luminous flux drop). The light emitting device can include a light emitting element, an optically transparent sealing resin having a pair of faces opposed to each other with an axis of light emitting direction of the light emitting device interposed therebetween. The sealing resin can cover the light emitting element and be mixed with a wavelength converting material. A reflective film can be provided on at least one of the pair of opposed faces of the sealing resin. The reflective film can be a white coating containing a white pigment in a concentration of 23 wt % to 54 wt % and formed to be 14 μm to 50 μm in thickness.
Public/Granted literature
- US20080210966A1 Light Emitting Device Public/Granted day:2008-09-04
Information query
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