Invention Grant
- Patent Title: Integrated circuit layout pattern for cross-coupled circuits
- Patent Title (中): 交叉耦合电路的集成电路布局图
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Application No.: US12285795Application Date: 2008-10-14
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Publication No.: US07960759B2Publication Date: 2011-06-14
- Inventor: Marlin Wayne Frederick , David Paul Clark
- Applicant: Marlin Wayne Frederick , David Paul Clark
- Applicant Address: GB Cambridge
- Assignee: ARM Limited
- Current Assignee: ARM Limited
- Current Assignee Address: GB Cambridge
- Agency: Nixon & Vanderhye P.C.
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
A circuit 32 is provided comprising a first diffusion region 34 and a parallel second diffusion region 36. A sequence of N gate layers 40, 42, 46 is provided with a first and an Nth of these gate layers covering different respective ones of the diffusion regions 34, 36 whilst the middle (N−2) gate layers 42 cover both diffusion regions 34, 36. A bridging conductor 64 connects the first gate layer 40 and the Nth gate layer 46. In some embodiments, the second diffusion region is provided as two second diffusion sub-regions 68, 70 having a diffusion region gap 74 therebetween and electrically connected via a jumper connector 42. A first gate layer 76 which forms a gate electrode with a first diffusion region 66 can extend through this diffusion region gap 74 not forming a gate electrode therewith and facilitating use of a collinear bridging conductor 82 to connect to the Nth gate layer 80.
Public/Granted literature
- US20100090260A1 Integrated circuit layout pattern for cross-coupled circuits Public/Granted day:2010-04-15
Information query
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