Invention Grant
US07960768B2 3D backside illuminated image sensor with multiplexed pixel structure
有权
具有复用像素结构的3D背面照明图像传感器
- Patent Title: 3D backside illuminated image sensor with multiplexed pixel structure
- Patent Title (中): 具有复用像素结构的3D背面照明图像传感器
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Application No.: US12015595Application Date: 2008-01-17
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Publication No.: US07960768B2Publication Date: 2011-06-14
- Inventor: Thomas Edward Dungan
- Applicant: Thomas Edward Dungan
- Applicant Address: KY Grand Cayman
- Assignee: Aptina Imaging Corporation
- Current Assignee: Aptina Imaging Corporation
- Current Assignee Address: KY Grand Cayman
- Agency: RatnerPrestia
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
A three-dimensional pixel array, a method of manufacturing a pixel array and an imager including the three-dimensional pixel array. The three-dimensional array includes multiple groups of pixels, each group of pixels including a first layer and a second layer. The first layer includes multiple photosensitive elements, one per pixel in the group, at least one floating diffusion region connected to each photosensitive element in the group via at least one respective transfer gate per pixel and multiple transfer gate lines, at least two transfer gate lines connected to each respective transfer gate in each row of pixels. The second layer includes at least a rest transistor per group and a source follower transistor coupled to the shared floating diffusion in the first layer.
Public/Granted literature
- US20090184349A1 3D BACKSIDE ILLUMINATED IMAGE SENSOR WITH MULTIPLEXED PIXEL STRUCTURE Public/Granted day:2009-07-23
Information query
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