Invention Grant
- Patent Title: Solid-state imaging device and method for manufacturing same
- Patent Title (中): 固态成像装置及其制造方法
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Application No.: US12408214Application Date: 2009-03-20
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Publication No.: US07960769B2Publication Date: 2011-06-14
- Inventor: Gaku Sudo
- Applicant: Gaku Sudo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-203047 20080806
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/02

Abstract:
In a CMOS image sensor, an N-type semiconductor layer is formed on a P-type semiconductor substrate. P-type semiconductor regions are formed in one part of the semiconductor layer over the entire length of the thickness direction of the semiconductor layer in a lattice-like shape as viewed from above to compartment the semiconductor layer into a plurality of regions. Furthermore, a red filter, a green filter and a blue filter are provided in a red picture element, a green picture element and a blue picture element, respectively. Moreover, an N-type buried semiconductor layer being in contact with the semiconductor layer is formed in an immediately lower region of the red filter in an upper layer part of the semiconductor substrate.
Public/Granted literature
- US20100032736A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2010-02-11
Information query
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