Invention Grant
- Patent Title: Semiconductor integrated circuit devices
- Patent Title (中): 半导体集成电路器件
-
Application No.: US12382596Application Date: 2009-03-19
-
Publication No.: US07960785B2Publication Date: 2011-06-14
- Inventor: Yong-Don Kim , Yong-Chan Kim , Joung-Ho Kim , Mueng-Ryul Lee , Eung-Kyu Lee , Jong-Wook Lim
- Applicant: Yong-Don Kim , Yong-Chan Kim , Joung-Ho Kim , Mueng-Ryul Lee , Eung-Kyu Lee , Jong-Wook Lim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0026386 20080321
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A semiconductor integrated circuit device may include: a substrate that includes a high-voltage device region and a low-voltage device region defined on the substrate; a first buried impurity layer formed in at least a portion of the high-voltage device region and coupled to a first voltage; a second buried impurity layer formed in at least a portion of the low-voltage device region and coupled to a second voltage less than the first voltage; and a well formed on the second buried impurity layer in the low-voltage device region and coupled to a third voltage less than the second voltage.
Public/Granted literature
- US20090267148A1 Semiconductor integrated circuit devices Public/Granted day:2009-10-29
Information query
IPC分类: