Invention Grant
- Patent Title: Leadframe design for QFN package with top terminal leads
- Patent Title (中): 具有顶端端子引线的QFN封装的引线框架设计
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Application No.: US12398806Application Date: 2009-03-05
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Publication No.: US07960815B2Publication Date: 2011-06-14
- Inventor: Zigmund R. Camacho , Henry D. Bathan , Jose Alvin Santos Caparas , Lionel Chien Hui Tay
- Applicant: Zigmund R. Camacho , Henry D. Bathan , Jose Alvin Santos Caparas , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group
- Agent Robert D. Atkins
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48
Abstract:
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
Public/Granted literature
- US20090166821A1 Leadframe Design for QFN Package with Top Terminal Leads Public/Granted day:2009-07-02
Information query
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