Invention Grant
- Patent Title: Semiconductor package with passive device integration
- Patent Title (中): 半导体封装采用无源器件集成
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Application No.: US11306354Application Date: 2005-12-23
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Publication No.: US07960816B2Publication Date: 2011-06-14
- Inventor: Seng Guan Chow , Il Kwon Shim , Ming Ying , Byung Hoon Ahn
- Applicant: Seng Guan Chow , Il Kwon Shim , Ming Ying , Byung Hoon Ahn
- Applicant Address: SG Singapore
- Assignee: ST Assembly Test Services Ltd.
- Current Assignee: ST Assembly Test Services Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.
Public/Granted literature
- US20060197198A1 SEMICONDUCTOR PACKAGE WITH PASSIVE DEVICE INTEGRATION Public/Granted day:2006-09-07
Information query
IPC分类:
