Semiconductor package

Invention Grant

US07960820B2 Semiconductor package 有权

Title translation: 半导体封装

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Patent Title: Semiconductor package
Patent Title (中): 半导体封装
Application No.: US12265203

Application Date: 2008-11-05
Publication No.: US07960820B2

Publication Date: 2011-06-14
Inventor: Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
Applicant: Akinori Shiraishi , Kei Murayama , Yuichi Taguchi , Masahiro Sunohara , Mitsutoshi Higashi
Applicant Address: JP Nagano-shi
Assignee: Shinko Electric Industries Co., Ltd.
Current Assignee: Shinko Electric Industries Co., Ltd.
Current Assignee Address: JP Nagano-shi
Agency: Rankin, Hill & Clark LLP
Priority: JP2007-288907 20071106
Main IPC: H01L23/14
IPC: H01L23/14

Abstract:

A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.

Abstract(Chinese):

一种半导体封装件，其中电子器件芯片设置在通过堆叠多个硅衬底而构成的硅衬底堆叠产品的空腔中。

Public/Granted literature

US20090115049A1 SEMICONDUCTOR PACKAGE Public/Granted day:2009-05-07

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/12	.安装架，例如不可拆卸的绝缘衬底
H01L23/14	..按其材料或它的电性能区分的