Invention Grant
- Patent Title: Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer level
- Patent Title (中): 半导体装置包括配置在相同层次的电源板和主干布线
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Application No.: US12461511Application Date: 2009-08-13
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Publication No.: US07960824B2Publication Date: 2011-06-14
- Inventor: Tetsuya Katou
- Applicant: Tetsuya Katou
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-241987 20080922
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor device includes a semiconductor substrate which includes a functional circuit, a trunk wiring which passes through a portion near a position immediately above a center portion of the functional circuit, a power supply pad which is connected to an end of the trunk wiring and placed at a layer level which is same as a layer level where the trunk wiring is placed, and a connection wiring which connects a substantially center portion of the functional circuit and the trunk wiring.
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