Invention Grant
US07960831B2 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
有权
限球冶金，与其一起使用的焊料凸块组合物，由此组装的封装，及其组装方法
- Patent Title: Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
- Patent Title (中): 限球冶金，与其一起使用的焊料凸块组合物，由此组装的封装，及其组装方法
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Application No.: US11840269Application Date: 2007-08-17
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Publication No.: US07960831B2Publication Date: 2011-06-14
- Inventor: Fay Hua , Albert T. Wu , Kevin Jeng , Krishna Seshan
- Applicant: Fay Hua , Albert T. Wu , Kevin Jeng , Krishna Seshan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.
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