Invention Grant
- Patent Title: Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body
- Patent Title (中): 电子元件，其包括具有含铝表面的第一电极与由金属纳米颗粒烧结体组成的第二电极之间的多层结合界面
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Application No.: US12256834Application Date: 2008-10-23
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Publication No.: US07960834B2Publication Date: 2011-06-14
- Inventor: Tatsuya Funaki
- Applicant: Tatsuya Funaki
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Dickstein Shapiro LLP
- Priority: JP2006-119200 20060424
- Main IPC: H01L23/492
- IPC: H01L23/492
Abstract:
An electronic element including an electronic element base and electrodes each of which has a first electrode having a surface composed of at least Al or an Al alloy and a second electrode composed of a metal nanoparticle sintered body and bonded to the first electrode. A bonding interface between the first electrode and the second electrode has a multilayer structure including, from the side of the first electrode to the side of the second electrode, (a) a first layer primarily composed of Al, (b) a second layer primarily composed of an Al oxide, (c) a third layer primarily composed of an alloy of Al and a constituent element of metal nanoparticles, and (d) a fourth layer primarily composed of the constituent element of the metal nanoparticles.
Public/Granted literature
- US20090039507A1 Electronic Element, Electronic Element Device Using the Same, and Manufacturing Method Thereof Public/Granted day:2009-02-12
Information query
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