Invention Grant
US07960846B2 Semiconductor device having improved solder joint and internal lead lifetimes
有权
具有改善的焊点和内部引线寿命的半导体器件
- Patent Title: Semiconductor device having improved solder joint and internal lead lifetimes
- Patent Title (中): 具有改善的焊点和内部引线寿命的半导体器件
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Application No.: US12363166Application Date: 2009-01-30
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Publication No.: US07960846B2Publication Date: 2011-06-14
- Inventor: Mitsuaki Katagiri , Hisashi Tanie
- Applicant: Mitsuaki Katagiri , Hisashi Tanie
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-052613 20040227
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor chip is mounted on a flexible wiring board through the interposition of an elastomer. The flexible wiring board is made up of a tape on which wiring is fixed. A part of the wiring is projected beyond the edge of the tape, extended in the direction of the thickness of the elastomer and connected to an electrode of the semiconductor chip. The edge of the tape beyond which the wiring is projected protrudes beyond the edge of the elastomer by a length no smaller than the thickness of the elastomer.
Public/Granted literature
- US20090140412A1 SEMICONDUCTOR DEVICE HAVING IMPROVED SOLDER JOINT AND INTERNAL LEAD LIFETIMES Public/Granted day:2009-06-04
Information query
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