Invention Grant
- Patent Title: Exposure apparatus, measurement method, stabilization method, and device fabrication method
- Patent Title (中): 曝光装置,测量方法,稳定方法和装置制造方法
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Application No.: US12416610Application Date: 2009-04-01
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Publication No.: US07961295B2Publication Date: 2011-06-14
- Inventor: Nobuhiko Yabu
- Applicant: Nobuhiko Yabu
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2008-104030 20080411
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03B27/58

Abstract:
The present invention provides an exposure apparatus including a projection optical system configured to project a reticle pattern onto a wafer, a selector configured to select a dummy wafer to be placed near an image plane of the projection optical system, from a plurality of dummy wafers having the same shape as that of the wafer and different reflectance with each other, a transfer unit configured to place the dummy wafer selected by the selector near the image plane of the projection optical system, and a controller configured to perform control such that dummy exposure is performed by irradiating the dummy wafer, which is placed near the image plane of the projection optical system by the transfer unit, with light via the projection optical system.
Public/Granted literature
- US20090257035A1 EXPOSURE APPARATUS, MEASUREMENT METHOD, STABILIZATION METHOD, AND DEVICE FABRICATION METHOD Public/Granted day:2009-10-15
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