Invention Grant
- Patent Title: Electronic apparatus and electronic apparatus manufacturing method
- Patent Title (中): 电子仪器和电子设备制造方法
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Application No.: US12533522Application Date: 2009-07-31
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Publication No.: US07961458B2Publication Date: 2011-06-14
- Inventor: Shuhei Yukawa , Yoshikazu Iriguchi
- Applicant: Shuhei Yukawa , Yoshikazu Iriguchi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-223375 20080901
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
An electronic apparatus includes a base body that is made of a resin and includes two first side surfaces and two second side surfaces, two first exterior members that are each made of metal and respectively cover the two first side surfaces, a second exterior member that is made of metal and adhered to one of the second side surfaces, a plurality of dowel pins provided to the two first exterior members, a plurality of dowel hole portions that are capable of receiving the plurality of dowel pins, respectively, a plurality of held portions provided on a surface of the second exterior member, in correspondence with the plurality of dowel hole portions, and a plurality of elastic holders that are provided on the one of the second side surfaces of the base body and capable of holding and elastically supporting the plurality of held portions, respectively.
Public/Granted literature
- US20100053874A1 ELECTRONIC APPARATUS AND ELECTRONIC APPARATUS MANUFACTURING METHOD Public/Granted day:2010-03-04
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