Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US12622852Application Date: 2009-11-20
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Publication No.: US07961467B2Publication Date: 2011-06-14
- Inventor: Takeshi Hongo
- Applicant: Takeshi Hongo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2009-082340 20090330
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.
Public/Granted literature
- US20100246129A1 Electronic Apparatus Public/Granted day:2010-09-30
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