Invention Grant
- Patent Title: Integrated circuit, and a mobile phone having the integrated circuit
- Patent Title (中): 集成电路和具有集成电路的手机
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Application No.: US11578502Application Date: 2005-04-04
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Publication No.: US07961478B2Publication Date: 2011-06-14
- Inventor: Alain Cousin
- Applicant: Alain Cousin
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP04300207 20040416
- International Application: PCT/IB2005/051110 WO 20050404
- International Announcement: WO2005/101502 WO 20051027
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10
Abstract:
In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.
Public/Granted literature
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