Invention Grant
- Patent Title: Test circuit and method for use in semiconductor memory device
- Patent Title (中): 用于半导体存储器件的测试电路和方法
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Application No.: US12155512Application Date: 2008-06-05
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Publication No.: US07961535B2Publication Date: 2011-06-14
- Inventor: Hi-Choon Lee
- Applicant: Hi-Choon Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0062719 20070626
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C29/00

Abstract:
A test circuit and method for use in a semiconductor memory device is provided. The test method for use in a semiconductor memory device including a plurality of memory blocks may include sequentially enabling a plurality of word lines by applying a stress to the wordlines and performing a test operation, in response to sequentially applied test addresses, each of the word lines being sequentially selected from the plurality of memory blocks and enabled.
Public/Granted literature
- US20090003104A1 Test circuit and method for use in semiconductor memory device Public/Granted day:2009-01-01
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