Invention Grant
US07962863B2 Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
有权
用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法，系统和计算机可读介质
- Patent Title: Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
- Patent Title (中): 用于确定用于预测晶片上的掩模版特征的可印刷性的模型的计算机实现的方法，系统和计算机可读介质
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Application No.: US12115830Application Date: 2008-05-06
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Publication No.: US07962863B2Publication Date: 2011-06-14
- Inventor: Bo Su , Gaurav Verma , Hong Du , Rui-fang Shi , Scott Andrews
- Applicant: Bo Su , Gaurav Verma , Hong Du , Rui-fang Shi , Scott Andrews
- Applicant Address: US CA San Jose
- Assignee: KLA-Tencor Corp.
- Current Assignee: KLA-Tencor Corp.
- Current Assignee Address: US CA San Jose
- Agent Ann Marie Mewherter
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer are provided. One method includes generating simulated images of the reticle features printed on the wafer using different generated models for a set of different values of exposure conditions. The method also includes determining one or more characteristics of the reticle features of the simulated images. In addition, the method includes comparing the one or more characteristics of the reticle features of the simulated images to one or more characteristics of the reticle features printed on the wafer using a lithography process. The method further includes selecting one of the different generated models as the model to be used for predicting the printability of the reticle features based on results of the comparing step.
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