Invention Grant
US07962880B2 Wire structures minimizing coupling effects between wires in a bus
有权
电线结构使母线电线之间的耦合效应最小化
- Patent Title: Wire structures minimizing coupling effects between wires in a bus
- Patent Title (中): 电线结构使母线电线之间的耦合效应最小化
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Application No.: US12035506Application Date: 2008-02-22
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Publication No.: US07962880B2Publication Date: 2011-06-14
- Inventor: Daniel Lipetz , Joshua M. Weinberg
- Applicant: Daniel Lipetz , Joshua M. Weinberg
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent William A. Kinnaman, Jr.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for minimizing coupling capacitance between wires in a bus comprising shifting by rearranging the order of said wires in said bus so that, aside from said first and last wires in said arrangement, the coupling capacitance across said bus is uniform and minimized relative to the original arrangement. Alternatively, a method for minimizing coupling capacitance between wires in a bus comprising shifting by rearranging the order of said wires in said bus so that, aside from said first and last wires in said arrangement, one of said wires incurs the smallest possible amount of coupling capacitance and then the coupling capacitance across the rest of said wires in said bus gets progressively worse relative to the original arrangement.
Public/Granted literature
- US20090217229A1 Wire Structures Minimizing Hostile Neighbors and Coupling Affects Public/Granted day:2009-08-27
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