Invention Grant
- Patent Title: Via structure to improve routing of wires within an integrated circuit
- Patent Title (中): 通过结构改善集成电路内导线的布线
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Application No.: US12181374Application Date: 2008-07-29
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Publication No.: US07962881B2Publication Date: 2011-06-14
- Inventor: Markus T. Buehler , Ankit Gangwar , Juergen Koehl , Arun K. Mishra
- Applicant: Markus T. Buehler , Ankit Gangwar , Juergen Koehl , Arun K. Mishra
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Yuanmin Cai
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In consideration for the fact that a connection on the upper layers of an integrated circuit needs to access a lower layer to connect to, e.g., a transistor, at least one via on each layer is required below the top layer used by a connection for each pin. The vias (i.e., the connection structures between wiring planes within an integrated circuit) are arranged such that the number of wiring resources blocked on the lower layers is reduced. Various rules govern which vias are chosen. The main characteristic is to elect only a certain number of wiring channels appropriate for the vias on a single layer and then apply an optimization within the restricted elected wiring channels on that layer to select the most appropriate vias.
Public/Granted literature
- US20100031220A1 VIA STRUCTURE TO IMPROVE ROUTING OF WIRES WITHIN AN INTEGRATED CIRCUIT Public/Granted day:2010-02-04
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