Invention Grant
- Patent Title: Suction head for mobile robot
- Patent Title (中): 移动机器人吸头
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Application No.: US11686059Application Date: 2007-03-14
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Publication No.: US07962997B2Publication Date: 2011-06-21
- Inventor: Moon-kee Chung , Young-Gyu Jung
- Applicant: Moon-kee Chung , Young-Gyu Jung
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2006-0024035 20060315
- Main IPC: A47L9/02
- IPC: A47L9/02

Abstract:
A suction head is provided for removing debris from a surface. The suction head includes a suction nozzle which has a generally semi-circular groove formed on an interior surface of the suction nozzle. Additionally, there is a suction hole formed at a generally central region of a rear surface of the nozzle and communicating with the semi-circular groove. Further, a uniform pressure forming region is provided at a longitudinally extending side of the semi-circular groove, and a suction pipe is mounted to the suction hole to guide air in the semi-circular groove through the suction hole.
Public/Granted literature
- US20070214601A1 SUCTION HEAD FOR MOBILE ROBOT Public/Granted day:2007-09-20
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